Semiconductor device

ABSTRACT

Stable electrical characteristics and high reliability are provided for a semiconductor device including an oxide semiconductor. In a transistor including an oxide semiconductor layer, a buffer layer containing a constituent similar to that of the oxide semiconductor layer is provided in contact with a top surface and a bottom surface of the oxide semiconductor layer. Such a transistor and a semiconductor device including the transistor are provided. As the buffer layer in contact with the oxide semiconductor layer, a film containing an oxide of one or more elements selected from aluminum, gallium, zirconium, hafnium, and a rare earth element can be used.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.15/199,020, filed Jun. 30, 2016, now allowed, which is a continuation ofU.S. application Ser. No. 13/537,365, filed Jun. 29, 2012, now U.S. Pat.No. 9,385,238, which claims the benefit of a foreign priorityapplication filed in Japan as Serial No. 2011-152164 on Jul. 8, 2011,all of which are incorporated by reference.

TECHNICAL FIELD

The present invention relates to a semiconductor device and a method ofmanufacturing the semiconductor device.

In this specification, a semiconductor device means all types of devicesthat can function by utilizing semiconductor characteristics, and anelectro-optical device, a semiconductor circuit, and an electronicdevice are all semiconductor devices.

BACKGROUND ART

A technique by which transistors are formed using semiconductor thinfilms over a substrate having an insulating surface has been attractingattention. The transistor is applied to a wide range of electronicdevices such as an integrated circuit (IC) and an image display device(display device). A silicon-based semiconductor material is widely knownas a material for a semiconductor thin film applicable to a transistor.As another material, an oxide semiconductor has been attractingattention.

For example, a transistor whose active layer includes an amorphous oxidecontaining indium (In), gallium (Ga), and zinc (Zn) and having anelectron carrier concentration lower than 10¹⁸/cm³ is disclosed (seePatent Document 1).

A transistor including an oxide semiconductor is known to have a problemof low reliability because of high possibility of change in electricalcharacteristics, although the transistor including an oxidesemiconductor can operate at higher speed than a transistor includingamorphous silicon and can be manufactured more easily than a transistorincluding polycrystalline silicon. For example, comparing the transistorbefore a BT test under light irradiation with that after the BT testunder light irradiation, the threshold voltage of the transistor ischanged by 1 V or more.

REFERENCE Patent Document

[Patent Document 1] Japanese Published Patent Application No.2006-165528

DISCLOSURE OF INVENTION

In view of the above problems, an object of one embodiment of thepresent invention is to provide a semiconductor device including anoxide semiconductor, which has stable electrical characteristics andhigh reliability.

One embodiment of the disclosed invention is a semiconductor deviceincluding an oxide semiconductor layer, and a first buffer layer and asecond buffer layer provided so that the oxide semiconductor layer issandwiched therebetween. As each of the first buffer layer and thesecond buffer layer, a film containing an oxide of one or more elementsselected from aluminum, gallium, zirconium, hafnium, and a rare earthelement can be used. Specifically, the following structure can beemployed, for example.

One embodiment of the present invention is a semiconductor deviceincluding a first buffer layer; an oxide semiconductor layer provided onand in contact with the first buffer layer; a second buffer layerprovided on and in contact with the oxide semiconductor layer so as tocover a side surface of the oxide semiconductor layer; a gate insulatingfilm provided over the second buffer layer; a gate electrode layeroverlapping with the oxide semiconductor layer with the gate insulatingfilm therebetween; an insulating film which is provided over the gateelectrode layer and has openings; and a source electrode layer and adrain electrode layer provided over the insulating film and electricallyconnected to the oxide semiconductor layer through the openings. Thefirst buffer layer and the second buffer layer each contain an oxide ofone or more elements selected from aluminum, gallium, zirconium,hafnium, and a rare earth element.

In the case where a silicon oxide film, which contains silicon that is aGroup 14 element, is used as an insulating layer in contact with theoxide semiconductor layer, the interface between the oxide semiconductorlayer and the silicon oxide film is less likely to be stable due to adifference in coordination number between the oxide semiconductormaterial and silicon, and thus an interface state might be formed. In atransistor according to one embodiment of the present invention, anoxide containing a constituent similar to that of the oxidesemiconductor layer is used for the buffer layer in contact with theoxide semiconductor layer; thus, formation of an interface state at theinterface between the oxide semiconductor layer and the buffer layer canbe prevented, and the transistor can have excellent electricalcharacteristics and high stability.

Another embodiment of the present invention is a semiconductor deviceincluding a first buffer layer; an oxide semiconductor layer provided onand in contact with the first buffer layer; a second buffer layerprovided on and in contact with the oxide semiconductor layer so as tocover a side surface of the first buffer layer and a side surface of theoxide semiconductor layer; a gate insulating film provided over thesecond buffer layer; a gate electrode layer overlapping with the oxidesemiconductor layer with the gate insulating film therebetween; aninsulating film which is provided over the gate electrode layer and hasopenings; and a source electrode layer and a drain electrode layerprovided over the insulating film and electrically connected to theoxide semiconductor layer through the openings. The first buffer layerand the second buffer layer each contain an oxide of one or moreelements selected from aluminum, gallium, zirconium, hafnium, and a rareearth element.

In any of the above semiconductor devices, the oxide semiconductor layerpreferably at least partly includes a region containing oxygen in excessof the stoichiometric ratio in a crystalline state.

The oxide semiconductor layer is preferably a crystalline semiconductorlayer. In this specification and the like, the crystalline oxidesemiconductor layer is an oxide semiconductor layer which includescrystals and which has crystallinity. The crystals in the crystallineoxide semiconductor layer may have crystal axes oriented in randomdirections or in a certain direction.

In one embodiment of the invention disclosed in this specification, aCAAC-OS (c-axis aligned crystalline oxide semiconductor) film can beused as the crystalline oxide semiconductor layer.

The CAAC-OS film is not completely single crystal nor completelyamorphous. The CAAC-OS film is an oxide semiconductor film with acrystal-amorphous mixed phase structure where crystal parts andamorphous parts are included. Note that in most cases, the crystal partfits inside a cube whose one side is less than 100 nm. In an imageobserved with a transmission electron microscope (TEM), a grain boundaryin the CAAC-OS film is not found. Thus, in the CAAC-OS film, a reductionin electron mobility due to the grain boundary is suppressed.

In each of the crystal parts included in the CAAC-OS film, a c-axis isaligned in a direction parallel to a normal vector of a surface wherethe CAAC-OS film is formed or a normal vector of a surface of theCAAC-OS film, triangular or hexagonal atomic arrangement which is seenfrom the direction perpendicular to the a-b plane is formed, and metalatoms are arranged in a layered manner or metal atoms and oxygen atomsare arranged in a layered manner when seen from the directionperpendicular to the c-axis. Note that, among crystal parts, thedirections of the a-axis and the b-axis of one crystal part may bedifferent from those of another crystal part. In this specification, asimple term “perpendicular” includes a range from 85° to 95°. Inaddition, a simple term “parallel” includes a range from −5° to 5°.

In the CAAC-OS film, distribution of crystal parts is not necessarilyuniform. For example, in the formation process of the CAAC-OS film, inthe case where crystal growth occurs from a surface side of the oxidesemiconductor film, the proportion of crystal parts in the vicinity ofthe surface of the oxide semiconductor film is higher than that in thevicinity of the surface where the oxide semiconductor film is formed insome cases. Further, when an impurity is added to the CAAC-OS film, thecrystal part in a region to which the impurity is added becomesamorphous in some cases.

Since the c-axes of the crystal parts included in the CAAC-OS film arealigned in the direction parallel to a normal vector of a surface wherethe CAAC-OS film is formed or a normal vector of a surface of theCAAC-OS film, the directions of the c-axes may be different from eachother depending on the shape of the CAAC-OS film (the cross-sectionalshape of the surface where the CAAC-OS film is formed or thecross-sectional shape of the surface of the CAAC-OS film). Note thatwhen the CAAC-OS film is formed, the direction of c-axis of the crystalpart is the direction parallel to a normal vector of the surface wherethe CAAC-OS film is formed or a normal vector of the surface of theCAAC-OS film. The crystal part is formed by film formation or byperforming treatment for crystallization such as heat treatment afterfilm formation.

The use of the CAAC-OS film for a transistor enables a change in theelectrical characteristics of the transistor due to irradiation withvisible light or ultraviolet light to be suppressed, so that a highlyreliable semiconductor device can be provided.

In any of the above semiconductor devices, a region in the oxidesemiconductor layer, which does not overlap with the gate electrodelayer, preferably contains a dopant. With such a structure, the oxidesemiconductor layer has a channel formation region which overlaps withthe gate electrode layer with the gate insulating film therebetween, anda pair of low-resistance regions between which the channel formationregion is sandwiched in the channel length direction.

With an oxide semiconductor layer including low-resistance regionsbetween which a channel formation region is sandwiched in the channellength direction, the transistor has excellent on characteristics (e.g.,on-state current and field-effect mobility) and enables high-speedoperation and high-speed response. Further, the low-resistance regionsare formed in a self-aligned manner and do not overlap with the gateelectrode layer; thus, parasitic capacitance can be reduced. A reductionin parasitic capacitance leads to lowering of power consumption of thewhole semiconductor device.

The concentration of the dopant in the low-resistance regions ispreferably higher than or equal to 5×10¹⁸/cm³ and lower than or equal to1×10²²/cm³.

Note that the term such as “over” in this specification and the likedoes not necessarily mean that a component is placed “directly on”another component. For example, the expression “a gate electrode over agate insulating layer” does not exclude the case where a component isplaced between the gate insulating layer and the gate electrode. Thesame applies to the term “below”.

In addition, in this specification and the like, the term “electrode” or“wiring” does not limit a function of a component. For example, an“electrode” is sometimes used as part of a “wiring”, and vice versa. Inaddition, the term “electrode” or “wiring” can also mean a combinationof a plurality of “electrodes” and “wirings”, for example.

According to one embodiment of the present invention, a highly reliablesemiconductor device including an oxide semiconductor and a method ofmanufacturing the semiconductor device can be provided.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A to 1C are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIGS. 2A to 2E illustrate an example of a manufacturing process of asemiconductor device.

FIGS. 3A and 3B are cross-sectional views each illustrating oneembodiment of a semiconductor device.

FIGS. 4A to 4C are a plan view and cross-sectional views illustratingone embodiment of a semiconductor device.

FIGS. 5A to 5C illustrate an example of a manufacturing process of asemiconductor device.

FIGS. 6A to 6C illustrate embodiments of a semiconductor device and anexample of a manufacturing step thereof.

FIGS. 7A to 7C each illustrate one embodiment of a semiconductor device.

FIGS. 8A and 8B each illustrate one embodiment of a semiconductordevice.

FIGS. 9A and 9B illustrate one embodiment of a semiconductor device.

FIGS. 10A to 10D each illustrate an electronic device.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described indetail with reference to the accompanying drawings. Note that thepresent invention is not limited to the description below, and it iseasily understood by those skilled in the art that modes and detailsdisclosed herein can be modified in various ways. Therefore, the presentinvention is not construed as being limited to the description of theembodiments below.

Note that in structures of the present invention described below, thesame portions or portions having similar functions are denoted by thesame reference numerals in different drawings, and description thereofis not repeated. Further, the same hatching pattern is applied toportions having similar functions, and the portions are not especiallydenoted by reference numerals in some cases.

Note that in each drawing described in this specification, the size, thefilm thickness, or the region of each component is exaggerated forclarity in some cases. Therefore, the scale of each structure is notnecessarily limited to that illustrated in the drawings.

Note that the ordinal numbers such as “first” and “second” in thisspecification and the like are used for convenience and do not denotethe order of steps or the stacking order of layers. In addition, theordinal numbers in this specification and the like do not denoteparticular names which specify the present invention.

Embodiment 1

In this embodiment, one embodiment of a semiconductor device and amethod of manufacturing the semiconductor device will be described withreference to FIGS. 1A to 1C, FIGS. 2A to 2E, and FIGS. 3A and 3B. Inthis embodiment, a transistor including an oxide semiconductor layerwill be described as an example of the semiconductor device.

A transistor 510 illustrated in FIG. 1A, FIG. 1B, and FIG. 1C is anexample of a top-gate transistor. FIG. 1A is a plan view, FIG. 1B is across-sectional view taken along chain line X-Y in FIG. 1A, and FIG. 1Cis a cross-sectional view taken along chain line V-W in FIG. 1A.

As illustrated in FIG. 1B, which is a cross-sectional view in thechannel length direction, the transistor 510 includes a first bufferlayer 101, an oxide semiconductor layer 102, a second buffer layer 103,a gate insulating film 402, a gate electrode layer 401, an insulatingfilm 407, a source electrode layer 405 a, and a drain electrode layer405 b over a substrate 400 having an insulating surface on which anoxide insulating film 436 is provided.

In the transistor 510, the first buffer layer 101 is formed on and incontact with the oxide insulating film 436, and the oxide semiconductorlayer 102 is formed over the first buffer layer 101. The second bufferlayer 103 is formed over the oxide semiconductor layer 102 so as tocover a side surface of the first buffer layer 101 and a side surface ofthe oxide semiconductor layer 102. The edge portion of the second bufferlayer 103 is in contact with the oxide insulating film 436.

Since the first buffer layer 101 and the second buffer layer 103 are incontact with the oxide semiconductor layer 102, they preferably includean oxide containing a constituent similar to that of the oxidesemiconductor layer 102. Specifically, the first buffer layer 101 andthe second buffer layer 103 preferably include an oxide of one or moreelements selected from a constituent element of the oxide semiconductorlayer 102 such as aluminum (Al), gallium (Ga), zirconium (Zr), orhafnium (Hf) and a rare earth element in the same group as aluminum,gallium, and the like. Among oxides of these elements, an oxide ofaluminum, gallium, or a rare earth element which is a Group III elementis more preferably used. As the rare earth element, scandium (Sc),yttrium (Y), cerium (Ce), samarium (Sm), or gadolinium (Gd) ispreferably used. Such a material is compatible with the oxidesemiconductor layer 102, and the use of such a material for the firstbuffer layer 101 and the second buffer layer 103 enables a state of theinterface between the oxide semiconductor layer 102 and each of theselayers to be favorable. Further, the crystallinity of the oxidesemiconductor layer 102 can be improved.

Note that since the oxide semiconductor layer 102 serves as an activelayer of the transistor 510, the energy gaps of the first buffer layer101 and the second buffer layer 103 need to be larger than that of theoxide semiconductor layer 102, and the first buffer layer 101 and thesecond buffer layer 103 preferably have insulating properties.

FIG. 1C is a cross-sectional view in the channel width direction. As inFIG. 1B, in a cross section in the channel width direction of thetransistor 510, a side surface of the oxide semiconductor layer 102 iscovered with an end portion of the second buffer layer 103. With such astructure, generation of a parasitic channel between the oxidesemiconductor layer 102 and the gate electrode layer 401 can beprevented.

FIGS. 2A to 2E illustrate an example of a method of manufacturing thetransistor 510.

First, the oxide insulating film 436, a first buffer film 101 a which isto be the first buffer layer 101, and an oxide semiconductor film 102 awhich is to be the oxide semiconductor layer 102 are formed in thisorder over the substrate 400 having an insulating surface (see FIG. 2A).

Although there is no particular limitation on a substrate that can beused as the substrate 400 having an insulating surface, it is necessarythat the substrate have at least heat resistance high enough towithstand heat treatment to be performed later. For example, a glasssubstrate of barium borosilicate glass, aluminoborosilicate glass, orthe like, a ceramic substrate, a quartz substrate, or a sapphiresubstrate can be used. A single crystal semiconductor substrate or apolycrystalline semiconductor substrate of silicon, silicon carbide, orthe like; a compound semiconductor substrate of silicon germanium or thelike; an SOI substrate; or the like can be used as the substrate 400, orthe substrate provided with a semiconductor element can be used as thesubstrate 400.

The semiconductor device may be manufactured using a flexible substrateas the substrate 400. In order to manufacture a flexible semiconductordevice, the transistor including the oxide semiconductor layer may bedirectly formed over a flexible substrate. Alternatively, the transistorincluding the oxide semiconductor layer may be formed over amanufacturing substrate, and then, the transistor may be separated andtransferred to a flexible substrate. Note that in order to separate thetransistor from the manufacturing substrate and transfer it to theflexible substrate, a separation layer may be provided between themanufacturing substrate and the transistor including the oxidesemiconductor layer.

The oxide insulating film 436 can be formed using silicon oxide, siliconoxynitride, or silicon nitride oxide by a plasma CVD method, asputtering method, or the like. The oxide insulating film 436 may haveeither a single-layer structure or a layered structure. A silicon oxidefilm formed by a sputtering method is used as the oxide insulating film436 in this embodiment.

As the first buffer film 101 a, a film containing an oxide of one ormore elements selected from aluminum, gallium, zirconium, hafnium, and arare earth element is formed. Such a material is compatible with theoxide semiconductor layer 102 to be formed later, and therefore, the useof such a material for a layer in contact with the oxide semiconductorlayer 102 enables a state of the interface with the oxide semiconductorlayer 102 to be kept favorable. Further, the use of such a material forthe first buffer layer 101 enables the crystallinity of the oxidesemiconductor layer 102 to be improved.

There is no particular limitation on the method of forming the firstbuffer film 101 a, and for example, the first buffer film 101 a may beformed by a deposition method such as a plasma CVD method or asputtering method.

The oxide semiconductor film formed over the first buffer film 101 a mayhave either a single-layer structure or a layered structure. Further,the oxide semiconductor film may either have an amorphous structure orbe a crystalline oxide semiconductor. In the case where the oxidesemiconductor film 102 a has an amorphous structure, heat treatment maybe performed on the oxide semiconductor layer in a later manufacturingstep so that the oxide semiconductor layer has crystallinity. The heattreatment for crystallizing the amorphous oxide semiconductor layer isperformed at a temperature higher than or equal to 250° C. and lowerthan or equal to 700° C., preferably higher than or equal to 400° C.,further preferably higher than or equal to 500° C., still furtherpreferably higher than or equal to 550° C. Note that this heat treatmentmay double as another heat treatment in the manufacturing process.

The oxide semiconductor film 102 a can be formed by a sputtering method,a molecular beam epitaxy (MBE) method, a CVD method, a pulse laserdeposition method, an atomic layer deposition (ALD) method, or the likeas appropriate. Alternatively, the oxide semiconductor film 102 a may beformed with a sputtering apparatus where film formation is performedwith surfaces of a plurality of substrates set substantiallyperpendicular to a surface of a sputtering target.

In the formation of the oxide semiconductor film 102 a, the hydrogenconcentration in the oxide semiconductor film 102 a is preferablyreduced as much as possible. In order to reduce the hydrogenconcentration, for example, in the case where the oxide semiconductorfilm 102 a is formed by a sputtering method, oxygen, a high-purity raregas (typically, argon) from which impurities such as hydrogen, water, ahydroxyl group, and hydride have been removed, or a mixed gas of oxygenand the rare gas is used as appropriate as an atmosphere gas supplied toa process chamber of a sputtering apparatus.

The oxide semiconductor layer is formed in such a manner that asputtering gas from which hydrogen and moisture have been removed isintroduced into the process chamber while moisture remaining therein isremoved, whereby the hydrogen concentration in the formed oxidesemiconductor layer can be reduced. In order to remove moistureremaining in the process chamber, an entrapment vacuum pump such as acryopump, an ion pump, or a titanium sublimation pump is preferablyused. As an evacuation unit, a turbo molecular pump provided with a coldtrap may be used. In the process chamber which is evacuated with thecryopump, a hydrogen atom, a compound containing a hydrogen atom such aswater (H₂O) (more preferably, also a compound containing a carbon atom),and the like are removed, whereby the impurity concentration in theoxide semiconductor film 102 a formed in the process chamber can bereduced.

The oxide insulating film 436, the first buffer film 101 a, and theoxide semiconductor film 102 a are preferably formed in successionwithout being exposed to the air. By forming the oxide insulating film436, the first buffer film 101 a, and the oxide semiconductor film 102 ain succession without being exposed to the air, impurities such ashydrogen and moisture can be prevented from being adsorbed onto theinterface between the oxide insulating film 436 and the first bufferfilm 101 a and the interface between the first buffer film 101 a and theoxide semiconductor film 102 a.

In order to reduce the impurity concentration in the oxide semiconductorfilm 102 a, it is also effective to form the oxide semiconductor film102 a while the substrate 400 is kept at high temperature. Thetemperature at which the substrate 400 is heated may be higher than orequal to 150° C. and lower than or equal to 450° C.; the substratetemperature is preferably higher than or equal to 200° C. and lower thanor equal to 350° C. By heating the substrate at high temperature duringthe film formation, a crystalline oxide semiconductor film can beformed.

An oxide semiconductor used for the oxide semiconductor film 102 apreferably contains at least indium (In) or zinc (Zn). In particular, Inand Zn are preferably contained. As a stabilizer for reducing avariation in electrical characteristics among transistors including theoxide semiconductor, gallium (Ga) is preferably contained in addition toIn and Zn. Tin (Sn) is preferably contained as a stabilizer. Hafnium(Hf) is preferably contained as a stabilizer. Aluminum (Al) ispreferably contained as a stabilizer. Zirconium (Zr) is preferablycontained as a stabilizer.

As another stabilizer, one or plural kinds of lanthanoid such aslanthanum (La), cerium (Ce), praseodymium (Pr), neodymium (Nd), samarium(Sm), europium (Eu), gadolinium (Gd), terbium (Tb), dysprosium (Dy),holmium (Ho), erbium (Er), thulium (Tm), ytterbium (Yb), or lutetium(Lu) may be contained.

As the oxide semiconductor, for example, indium oxide, tin oxide, zincoxide, a two-component metal oxide such as an In—Zn-based oxide, aSn—Zn-based oxide, an Al—Zn-based oxide, a Zn—Mg-based oxide, aSn—Mg-based oxide, an In—Mg-based oxide, or an In—Ga-based oxide, athree-component metal oxide such as an In—Ga—Zn-based oxide, anIn—Al—Zn-based oxide, an In—Sn—Zn-based oxide, a Sn—Ga—Zn-based oxide,an Al—Ga—Zn-based oxide, a Sn—Al—Zn-based oxide, an In—Hf—Zn-basedoxide, an In—La—Zn-based oxide, an In—Ce—Zn-based oxide, anIn—Pr—Zn-based oxide, an In—Nd—Zn-based oxide, an In—Sm—Zn-based oxide,an In—Eu—Zn-based oxide, an In—Gd—Zn-based oxide, an In—Tb—Zn-basedoxide, an In—Dy—Zn-based oxide, an In—Ho—Zn-based oxide, anIn—Er—Zn-based oxide, an In—Tm—Zn-based oxide, an In—Yb—Zn-based oxide,or an In—Lu—Zn-based oxide, or a four-component metal oxide such as anIn—Sn—Ga—Zn-based oxide, an In—Hf—Ga—Zn-based oxide, anIn—Al—Ga—Zn-based oxide, an In—Sn—Al—Zn-based oxide, anIn—Sn—Hf—Zn-based oxide, or an In—Hf—Al—Zn-based oxide can be used.

Note that it is preferable that the oxide semiconductor film 102 a beformed under a condition that much oxygen is contained during filmformation (e.g., formed by a sputtering method in a 100% oxygenatmosphere), so as to be a film containing much oxygen (preferablyhaving a region containing oxygen in excess of the stoichiometric ratioin the oxide semiconductor in a crystalline state).

It is preferable that a high-purity gas from which impurities such ashydrogen, water, a hydroxyl group, and hydride have been removed be usedas a sputtering gas used for the formation of the oxide semiconductorfilm 102 a.

In this embodiment, the oxide semiconductor film 102 a is formed at afilm formation temperature higher than or equal to 200° C. and lowerthan or equal to 450° C. in a rare gas (typically, argon) atmosphere, anoxygen atmosphere, or a mixed atmosphere of a rare gas and oxygen; insuch a manner, the crystalline oxide semiconductor film of an oxidesemiconductor having a crystalline region is formed.

For example, as the oxide semiconductor having a crystalline region, aCAAC-OS film can be used. There are three methods for obtaining theCAAC-OS film. The first method is to form an oxide semiconductor film ata film formation temperature higher than or equal to 200° C. and lowerthan or equal to 450° C., thereby obtaining c-axis alignmentsubstantially perpendicular to a surface. The second method is to form athin oxide semiconductor film and then subject the film to heattreatment performed at a temperature higher than or equal to 200° C. andlower than or equal to 700° C., thereby obtaining c-axis alignmentsubstantially perpendicular to a surface. The third method is to form afirst thin oxide semiconductor film, subject the film to heat treatmentperformed at a temperature higher than or equal to 200° C. and lowerthan or equal to 700° C., and then form a second oxide semiconductorfilm, thereby obtaining c-axis alignment substantially perpendicular toa surface.

For example, the CAAC-OS film is formed by a sputtering method with apolycrystalline oxide semiconductor sputtering target. When ions collidewith the sputtering target, a crystal region included in the sputteringtarget may be separated from the target along an a-b plane; in otherwords, a sputtered particle having a plane parallel to an a-b plane(flat-plate-like sputtered particle or pellet-like sputtered particle)may flake off from the sputtering target. In that case, theflat-plate-like sputtered particle reaches a substrate while maintainingtheir crystal state, whereby the CAAC-OS film can be formed.

For the deposition of the CAAC-OS film, the following conditions arepreferably used.

By reducing the amount of impurities entering the CAAC-OS film duringthe deposition, the crystal state can be prevented from being broken bythe impurities. For example, the concentration of impurities (e.g.,hydrogen, water, carbon dioxide, or nitrogen) which exist in thedeposition chamber may be reduced. Furthermore, the concentration ofimpurities in a deposition gas may be reduced. Specifically, adeposition gas whose dew point is −80° C. or lower, preferably −100° C.or lower is used.

By increasing the substrate heating temperature during the deposition,migration of a sputtered particle is likely to occur after the sputteredparticle reaches a substrate surface. Specifically, the substrateheating temperature during the deposition is higher than or equal to100° C. and lower than or equal to 740° C., preferably higher than orequal to 200° C. and lower than or equal to 500° C. By increasing thesubstrate heating temperature during the deposition, when theflat-plate-like sputtered particle reaches the substrate, migrationoccurs on the substrate surface, so that a flat plane of theflat-plate-like sputtered particle is attached to the substrate.

Furthermore, it is preferable that the proportion of oxygen in thedeposition gas be increased and the power be optimized in order toreduce plasma damage at the deposition. The proportion of oxygen in thedeposition gas is 30 vol % or higher, preferably 100 vol %.

As an example of the sputtering target, an In—Ga—Zn—O compound target isdescribed below.

The In—Ga—Zn—O compound target, which is polycrystalline, is made bymixing InO_(X) powder, GaO_(Y) powder, and ZnO_(Z) powder in apredetermined molar ratio, applying pressure, and performing heattreatment at a temperature higher than or equal to 1000° C. and lowerthan or equal to 1500° C. Note that X, Y and Z are given positivenumbers. Here, the predetermined molar ratio of InO_(X) powder toGaO_(Y) powder and ZnO_(Z) powder is, for example, 2:2:1, 8:4:3, 3:1:1,1:1:1, 4:2:3, or 3:1:2. The kinds of powder and the molar ratio formixing powder may be determined as appropriate depending on the desiredsputtering target.

In a crystalline oxide semiconductor, defects in a bulk can be furtherreduced, and when a surface flatness is improved, mobility higher thanthat of an oxide semiconductor in an amorphous state can be obtained. Inorder to improve the surface flatness, the oxide semiconductor ispreferably formed on a flat surface. Specifically, the oxidesemiconductor may be formed on a surface with an average surfaceroughness (R_(a)) of 1 nm or less, preferably 0.3 nm or less, morepreferably 0.1 nm or less.

Note that R_(a) is obtained by expanding arithmetic mean surfaceroughness, which is defined by JIS B 0601: 2001 (ISO4287: 1997), intothree dimensions so as to be applied to a curved surface. In addition,R_(a) can be expressed as “an average value of the absolute values ofdeviations from a reference surface to a specific surface” and isdefined by the following formula.

$\begin{matrix}{{Ra} = {\frac{1}{S_{0}}{\int_{y_{1}}^{y_{2}}{\int_{x_{1}}^{x_{2}}{{{{f( {x,y} )} - Z_{0}}}{dxdy}}}}}} & \lbrack {{Formula}\mspace{14mu} 1} \rbrack\end{matrix}$

Here, the specific surface is a surface which is a target of roughnessmeasurement, and is a quadrilateral region which is specified by fourpoints represented by the coordinates (x₁, y₁, f(x₁, y₁)), (x₁, y₂,f(x₁, y₂)), (x₂, y₁, f(x₂, y₁)), and (x₂, y₂, f(x₂, y₂)). Moreover, S₀represents the area of a rectangle which is obtained by projecting thespecific surface on the xy plane, and Z₀ represents the height of thereference surface (the average height of the specific surface). Further,R_(a) can be measured using an atomic force microscope (AFM).

Thus, planarization treatment may be performed on a region of the oxidefirst buffer film 101 a which is in contact with the oxide semiconductorfilm 102 a. The planarization treatment may be, but not particularlylimited to, polishing treatment (such as chemical mechanical polishing(CMP)), dry etching treatment, or plasma treatment.

As plasma treatment, reverse sputtering in which an argon gas isintroduced and plasma is generated can be performed.

As the planarization treatment, polishing treatment, dry etchingtreatment, or plasma treatment may be performed plural times, or thesetreatments may be performed in combination. In the case where thetreatments are combined, the order of steps is not particularly limitedand may be set as appropriate depending on the roughness of the surfaceof the first buffer film 101 a.

In this embodiment, the oxide semiconductor film 102 a is formed overthe first buffer film 101 a which is an oxide film containing aconstituent similar to that of the oxide semiconductor film 102 a.Therefore, the state of the interface between these two layers can bemade favorable, and the crystallinity in the vicinity of the interfacecan be improved.

Next, the first buffer film 101 a and the oxide semiconductor film 102 aare processed into island shapes by a photolithography step, so that thefirst buffer layer 101 and the oxide semiconductor layer 102 are formed.

A resist mask used for forming the first buffer layer 101 and the oxidesemiconductor layer 102 may be formed by an inkjet method. Formation ofthe resist mask by an inkjet method needs no photomask; thus,manufacturing cost can be reduced.

Note that etching of the first buffer film 101 a and the oxidesemiconductor film 102 a may be dry etching, wet etching, or both dryetching and wet etching.

In this embodiment, the first buffer film 101 a and the oxidesemiconductor film 102 a are processed by etching with the use of thesame mask, so that end portions of the side surfaces of the first bufferlayer 101 and the oxide semiconductor layer 102 formed through theprocessing are aligned and the first buffer layer 101 and the oxidesemiconductor layer 102 have the same shape.

Further, the oxide semiconductor layer 102 is preferably subjected toheat treatment for removing excess hydrogen (including water and ahydroxyl group) in the oxide semiconductor layer 102 (dehydration ordehydrogenation). The temperature of the heat treatment is higher thanor equal to 300° C. and lower than or equal to 700° C., or lower thanthe strain point of the substrate. The heat treatment can be performedunder reduced pressure, a nitrogen atmosphere, or the like.

Hydrogen, which is an n-type impurity, can be removed from the oxidesemiconductor by the heat treatment. For example, the hydrogenconcentration in the oxide semiconductor layer 102 after the dehydrationor dehydrogenation treatment can be 5×10¹⁹/cm³ or lower, preferably5×10¹⁸/cm³ or lower.

Note that the heat treatment for the dehydration or dehydrogenation maybe performed at any timing in the process of manufacturing thetransistor 510 as long as it is performed between the formation of theoxide semiconductor film 102 a and formation of the insulating film 407which is to be formed later. In the case where an aluminum oxide film isformed as the second buffer layer 103, the heat treatment is preferablyperformed before the second buffer layer 103 is formed. The heattreatment for the dehydration or dehydrogenation may be performed pluraltimes, and may double as another heat treatment.

The heat treatment for the dehydration or dehydrogenation is preferablyperformed before the oxide semiconductor film 102 a is processed into anisland shape because oxygen contained in the oxide insulating film 436can be prevented from being released by the heat treatment.

Note that in the heat treatment, it is preferable that water, hydrogen,and the like be not contained in nitrogen or a rare gas such as helium,neon, or argon. The purity of nitrogen or a rare gas such as helium,neon, or argon which is introduced into a heat treatment apparatus ispreferably 6N (99.9999%) or higher, more preferably 7N (99.99999%) orhigher (that is, the impurity concentration is preferably 1 ppm orlower, more preferably 0.1 ppm or lower).

In addition, after the oxide semiconductor layer 102 is heated by theheat treatment, a high-purity oxygen gas, a high-purity N₂O gas, orultra dry air (the moisture amount is less than or equal to 20 ppm (−55°C. by conversion into a dew point), preferably less than or equal to 1ppm, more preferably less than or equal to 10 ppb, in the measurementwith the use of a dew point meter of a cavity ring down laserspectroscopy (CRDS) system) may be introduced into the same furnacewhile the heating temperature is maintained or slow cooling is performedto lower the temperature from the heating temperature. It is preferablethat water, hydrogen, or the like be not contained in the oxygen gas orthe N₂O gas. The purity of the oxygen gas or the N₂O gas which isintroduced into the heat treatment apparatus is preferably 6N or higher,more preferably 7N or higher (i.e., the impurity concentration in theoxygen gas or the N₂O gas is preferably 1 ppm or lower, more preferably0.1 ppm or lower). The oxygen gas or the N₂O gas acts to supply oxygenthat is a main component of the oxide semiconductor and that has beenreduced by removing an impurity for the dehydration or dehydrogenation,so that the oxide semiconductor layer 102 can have high purity and be ani-type (intrinsic) oxide semiconductor layer.

Through this heat treatment, the first buffer layer 101 containing aconstituent similar to that of the oxide semiconductor layer 102 canalso be highly purified. Further, the crystallinity of the oxidesemiconductor layer 102 (in a bulk and the vicinity of the interfacewith the first buffer layer 101) can also be improved.

Next, the second buffer layer 103 is formed to cover the island-shapedfirst buffer layer 101 and the island-shaped oxide semiconductor layer102 (see FIG. 2B). The deposition conditions of the second buffer layer103 are the same as those of the first buffer layer 101; thusdescription thereof is omitted here. Note that by a secondphotolithography step, the second buffer layer 103 which overlaps withthe oxide semiconductor layer 102 and has a top surface shape largerthan a plan area of the oxide semiconductor layer 102 is formed. Sincethe second buffer layer 103 is an oxide film containing a constituentsimilar to that of the oxide semiconductor layer 102, the state of theinterface between these two layers can be made favorable. Further, thecrystallinity in the vicinity of the interface between the oxidesemiconductor layer 102 and the second buffer layer 103 can be improved.

Next, the gate insulating film 402 is formed to cover the second bufferlayer 103 (see FIG. 2C).

The gate insulating film 402 can be formed with a thickness greater thanor equal to 1 nm and less than or equal to 20 nm by a sputtering method,an MBE method, a CVD method, a pulsed laser deposition method, an ALDmethod, or the like as appropriate. The gate insulating film 402 may beformed with a sputtering apparatus where film formation is performedwith surfaces of a plurality of substrates set substantiallyperpendicular to a surface of a sputtering target.

The gate insulating film 402 can be formed using a silicon oxide film, asilicon nitride film, a silicon oxynitride film, or a silicon nitrideoxide film. The gate insulating film 402 may have either a single-layerstructure or a layered structure.

Next, the gate electrode layer 401 is formed over the gate insulatingfilm 402 by a plasma CVD method, a sputtering method, or the like (seeFIG. 2D).

The gate electrode layer 401 can be formed using a metal material suchas molybdenum, titanium, tantalum, tungsten, aluminum, copper, chromium,neodymium, or scandium or an alloy material which contains any of thesematerials as its main component. Alternatively, a semiconductor filmtypified by a polycrystalline silicon film doped with an impurityelement such as phosphorus, or a silicide film such as a nickel silicidefilm may be used as the gate electrode layer 401. The gate electrodelayer 401 may have either a single-layer structure or a layeredstructure.

The gate electrode layer 401 can also be formed using a conductivematerial such as indium tin oxide, indium oxide containing tungstenoxide, indium zinc oxide containing tungsten oxide, indium oxidecontaining titanium oxide, indium tin oxide containing titanium oxide,indium zinc oxide, or indium tin oxide to which silicon oxide is added.Alternatively, the gate electrode layer 401 may have a layered structureof the above conductive material and the above metal material.

As one layer of the gate electrode layer 401 which is in contact withthe gate insulating film 402, a metal oxide containing nitrogen,specifically, an In—Ga—Zn-based oxide film containing nitrogen, anIn—Sn-based oxide film containing nitrogen, an In—Ga-based oxide filmcontaining nitrogen, an In—Zn-based oxide film containing nitrogen, aSn-based oxide film containing nitrogen, an In-based oxide filmcontaining nitrogen, or a metal nitride (e.g., InN or SnN) film can beused. Such a film has a work function of 5 eV or higher, preferably 5.5eV or higher, and use of this film as the gate electrode layer enablesthe threshold voltage of electrical characteristics of a transistor tobe a positive value. Accordingly, a so-called normally-off switchingelement can be obtained.

Next, the insulating film 407 is formed over the gate insulating film402 and the gate electrode layer 401.

The insulating film 407 can be formed using a material similar to thatof the gate insulating film 402.

As the insulating film 407, a planarization insulating film may be used.As the planarization insulating film, an organic material such as apolyimide-based resin, an acrylic-based resin, or abenzocyclobutene-based resin can be used. In addition to the aboveorganic materials, a low-dielectric constant material (a low-k material)or the like can be used. Note that the planarization insulating film maybe formed by stacking a plurality of insulating films formed using anyof these materials.

Next, contact holes (openings) reaching the oxide semiconductor layer102 are formed in the insulating film 407, and the source electrodelayer 405 a and the drain electrode layer 405 b electrically connectedto the oxide semiconductor layer 102 are formed in the respectivecontact holes (see FIG. 2E).

As the conductive film used for forming the source electrode layer andthe drain electrode layer, it is possible to use, for example, a metalfilm containing an element selected from Al, Cr, Cu, Ta, Ti, Mo, or W, ametal nitride film containing any of these elements as its component (atitanium nitride film, a molybdenum nitride film, or a tungsten nitridefilm), or the like. Alternatively, a film of a high-melting-point metalsuch as Ti, Mo, or W or a metal nitride film thereof (e.g., a titaniumnitride film, a molybdenum nitride film, or a tungsten nitride film) maybe formed over or/and below a metal film such as an Al film or a Cufilm. Further, a dopant such as phosphorus or boron may be added to theconductive film used for forming the source electrode layer 405 a andthe drain electrode layer 405 b.

Through the above steps, the transistor 510 can be formed.

FIGS. 3A and 3B and FIGS. 4A to 4C illustrate structures of a transistoraccording to this embodiment, which are different from that of thetransistor 510. The transistors illustrated in FIGS. 3A and 3B and FIGS.4A to 4C are just partly different from the transistor 510 describedabove; thus, the same reference numerals are used to denote the sameportions for simplification, and detailed description of the sameportion is omitted in this embodiment.

A transistor 520 illustrated in FIG. 3A has a structure in which part ofthe oxide insulating film 436 is etched to be thin with the use of amask which is used for processing the first buffer film 101 a and theoxide semiconductor film 102 a into island shapes (or with the use ofthe island-shaped first buffer layer 101 and oxide semiconductor layer102 which are manufactured by the processing, as a mask). In thetransistor 520, a region of the oxide insulating film 436 which overlapswith the island-shaped first buffer layer 101 and oxide semiconductorlayer 102 has a larger thickness than the other regions of the oxideinsulating film 436 (which do not overlap with the island-shaped firstbuffer layer 101 and oxide semiconductor layer 102). By etching part ofthe oxide insulating film 436 at the time of processing for forming theisland-shaped first buffer layer 101 and oxide semiconductor layer 102,an etching residue of the oxide semiconductor layer 102 or the like isremoved, and thus generation of leakage current can be prevented.

A transistor 530 illustrated in FIG. 3B has a structure in which thefirst buffer layer 101, the oxide semiconductor layer 102, and thesecond buffer layer 103 are formed so as to have island shapes throughthree photolithography steps. The island-shaped first buffer layer 101,oxide semiconductor layer 102, and second buffer layer 103 in thetransistor 530 are formed in the following manner: after the firstbuffer film 101 a is formed, the island-shaped first buffer layer 101 isformed with the use of a first mask; after the oxide semiconductor film102 a is formed over the island-shaped first buffer layer 101, theisland-shaped oxide semiconductor layer 102 is formed with the use of asecond mask; and after a second buffer film 103 a which is to be thesecond buffer layer 103 is formed over the island-shaped first bufferlayer 101 and oxide semiconductor layer 102, the second buffer film 103a is processed into an island shape with the use of a third mask.

In the transistor 530, a side surface of the first buffer layer 101extends beyond a side surface of the oxide semiconductor layer 102, andthe second buffer layer 103 is in contact with part of a top surface ofthe first buffer layer 101. An end portion of the second buffer layer103 is in contact with and overlaps with an end portion of the firstbuffer layer 101.

FIGS. 4A to 4C illustrate a structure of a transistor 540. FIG. 4A is aplan view, FIG. 4B is a cross-sectional view taken along chain line X-Yin FIG. 4A, and FIG. 4C is a cross-sectional view taken along chain lineV-W in FIG. 4A.

As illustrated in the cross-sectional view in the channel lengthdirection in FIG. 4B, the transistor 540 includes the first buffer film101 a, the island-shaped oxide semiconductor layer 102 provided over thefirst buffer film 101 a, the source electrode layer 405 a and the drainelectrode layer 405 b provided on and in contact with the oxidesemiconductor layer 102, the second buffer layer 103 provided over thesource electrode layer 405 a and the drain electrode layer 405 b and incontact with at least a channel formation region of the oxidesemiconductor layer 102, the gate insulating film 402, and the gateelectrode layer 401. In the transistor 540, the insulating film 407 maybe provided over the gate electrode layer 401.

As illustrated in the cross-sectional view in the channel widthdirection in FIG. 4C, in a cross section in the channel width directionof the transistor 540, a side surface of the oxide semiconductor layer102 is covered with an end portion of the second buffer layer 103. Withsuch a structure, generation of a parasitic channel between the oxidesemiconductor layer 102 and the gate electrode layer 401 can beprevented.

In the transistor 540 illustrated in FIGS. 4B and 4C, the second bufferlayer 103 is provided so as to cover the source electrode layer 405 aand the drain electrode layer 405 b, and to be in contact with the firstbuffer film 101 a and the oxide semiconductor layer 102. That is, theoxide semiconductor layer 102 is surrounded by the first buffer film 101a and the second buffer layer 103. As in the transistor 510 or the like,the first buffer layer 101 may be formed by processing the first bufferfilm 101 a into an island shape.

The first buffer film 101 a and the second buffer layer 103 may beformed using the same material, or different materials selected fromthose described above. In the case where the first buffer film 101 a andthe second buffer layer 103 are formed using the same material (ormaterials with which sufficient etching selectivity cannot be obtained),the etching for processing the second buffer layer 103 into an islandshape may be controlled by adjusting the etching time. When the secondbuffer layer 103 is formed by the processing, part of the first bufferfilm 101 a might be etched and thus the thickness of a region where thefirst buffer film 101 a does not overlap with the second buffer layer103 might be smaller than that of a region where the first buffer film101 a overlaps with the second buffer layer 103.

In each of the transistors described in this embodiment, the bufferlayer containing a constituent similar to that of the oxidesemiconductor layer is provided on and in contact with the top surfaceand the bottom surface of the oxide semiconductor layer. By providingthe buffer layer containing a material compatible with the oxidesemiconductor layer in contact with the oxide semiconductor layer inthis manner, the interface between the buffer layer and the oxidesemiconductor layer can be made favorable. Thus, charge or the likegenerated due to the operation of a semiconductor device can beprevented from being trapped at the interface between the oxidesemiconductor layer and the buffer layer. With such a structure, theoxide semiconductor layer can be less adversely affected by charge,which suppresses shift of the threshold value of the transistor due totrapping of charge at the interface of the oxide semiconductor layer.

In the case where the oxide semiconductor layer is a crystalline oxidesemiconductor layer, the buffer layer containing a constituent similarto that of the oxide semiconductor layer, which is provided in contactwith the oxide semiconductor layer, enables the crystallinity in thevicinity of the interface between the oxide semiconductor layer and thebuffer layer to be improved. Therefore, crystalline regions can beformed at the interface between the oxide semiconductor layer and thebuffer layer which are in contact with each other and in the bulk, andthus the level in a band of the crystalline oxide semiconductor layercan be reduced. Consequently, the transistor characteristics can beimproved.

With the use of such a crystalline oxide semiconductor layer for atransistor, it is possible to provide a highly reliable semiconductordevice in which changes of the electrical characteristics of thetransistor due to irradiation with visible light or ultraviolet lightcan be suppressed.

In this embodiment, the oxide semiconductor layer used for the activelayer of the transistor is an oxide semiconductor layer highly purifiedto be i-type (intrinsic) by removing impurities such as hydrogen,moisture, a hydroxyl group, and hydride (also referred to as a hydrogencompound) from the oxide semiconductor by heat treatment and supplyingoxygen which is a major constituent of the oxide semiconductor and issimultaneously reduced in a step of removing impurities. The transistorincluding the oxide semiconductor layer highly purified in such a mannerhas electrical characteristics which are less likely to change, and thusis electrically stable.

As described above, a semiconductor device formed using an oxidesemiconductor, which has stable electrical characteristics, can beprovided. Accordingly, a semiconductor device with high reliability canbe provided.

The structures, methods, and the like described in this embodiment canbe combined as appropriate with any of the structures, methods, and thelike described in the other embodiments.

Embodiment 2

In this embodiment, another embodiment of a semiconductor device and amethod of manufacturing the semiconductor device will be described withreference to FIGS. 5A to 5C. In this embodiment, the same portions asthose in Embodiment 1 and portions having functions similar to those inEmbodiment 1 and the same steps as those in Embodiment 1 and stepssimilar to those in Embodiment 1 may be handled as in Embodiment 1, andrepeated description is omitted. In addition, detailed description ofthe same portions is not repeated.

This embodiment shows an example in which in a method of manufacturing asemiconductor device according to one embodiment of the disclosedinvention, oxygen (including at least one of an oxygen radical, anoxygen atom, and an oxygen ion) is introduced into an oxidesemiconductor layer that has been subjected to dehydration ordehydrogenation treatment so that oxygen is supplied to the oxidesemiconductor layer.

Through the dehydration or dehydrogenation treatment, oxygen that is amain component material of an oxide semiconductor might be eliminatedand thus might be reduced. There is an oxygen deficiency in a portionwhere oxygen is eliminated in the oxide semiconductor layer and a donorlevel which causes variation in the electrical characteristics of atransistor is formed owing to the oxygen deficiency.

Thus, oxygen is preferably supplied to the oxide semiconductor layerwhich has been subjected to the dehydration or dehydrogenationtreatment. By supply of oxygen to the oxide semiconductor layer, oxygendeficiency in the oxide semiconductor layer can be filled. With the useof the oxide semiconductor layer for a transistor, a fluctuation in thethreshold voltage Vth of the transistor and a shift of the thresholdvoltage Vth of the transistor due to oxygen deficiency can be reduced.Further, the threshold voltage of the transistor can be positivelyshifted to make the transistor normally off

FIG. 5A corresponds to FIG. 2C, in which the first buffer layer 101, theoxide semiconductor layer 102, the second buffer layer 103, and the gateinsulating film 402 are formed over the substrate 400 having aninsulating surface on which the oxide insulating film 436 is provided.

Next, oxygen 431 (including at least one of an oxygen radical, an oxygenatom, and an oxygen ion) is added to the oxide semiconductor layer 102;thus, oxygen is supplied to the oxide semiconductor layer 102 so that anoxygen-excess region 112 is formed in the oxide semiconductor layer 102(see FIG. 5B).

The oxygen-excess region 112 at least partly includes a regioncontaining oxygen in excess of the stoichiometric ratio in the oxidesemiconductor in a crystalline state. Oxygen deficiency in the oxidesemiconductor layer 102 or at an interface of the oxide semiconductorlayer 102 can be filled with the oxygen 431 supplied to theoxygen-excess region 112. Note that in the step of adding oxygen to theoxide semiconductor layer 102, an oxygen-excess region may be formed inthe first buffer layer 101 or/and the second buffer layer 103 in contactwith the oxide semiconductor layer 102.

Next, the gate electrode layer 401 is formed in a region overlappingwith the oxide semiconductor layer 102 which includes the oxygen-excessregion 112. After that, the insulating film 407 is formed over the gateinsulating film 402 and the gate electrode layer 401, and the sourceelectrode layer 405 a and the drain electrode layer 405 b are formed soas to be electrically connected to the oxide semiconductor layer 102through contact holes provided in the insulating film 407. Through thesesteps, a transistor 410 is manufactured (see FIG. 5C).

In the transistor described in this embodiment, oxygen is added to thedehydrated or dehydrogenated oxide semiconductor layer 102 to besupplied thereto, so that the oxide semiconductor layer 102 can behighly purified and be i-type (intrinsic). Variation in the electricalcharacteristics of the transistor 410 including the highly purified andi-type (intrinsic) oxide semiconductor layer 102 is suppressed and thetransistor 410 is thus electrically stable.

Oxygen can be added by an ion implantation method, an ion doping method,a plasma immersion ion implantation method, plasma treatment, or thelike.

Although the step of adding the oxygen 431 to the oxide semiconductorlayer 102 through the gate insulating film 402 is described in thisembodiment, there is no particular limitation on the timing of theaddition of oxygen to the oxide semiconductor layer 102 as long as it isperformed after the dehydration or dehydrogenation treatment. Further,oxygen may be added plural times to the oxide semiconductor layer 102after the dehydration or dehydrogenation treatment is performed. Forexample, the oxygen 431 may be added in the state where the oxidesemiconductor layer 102 is exposed, or oxygen may be added to the oxidesemiconductor layer 102 through the insulating film 407. Note that inthe case where the oxygen 431 is added in the state where the oxidesemiconductor layer 102 is exposed, plasma treatment can also be used.

Further, in the oxygen-excess region 112 of the oxide semiconductorlayer 102, the concentration of oxygen added through the step of addingoxygen is preferably higher than or equal to 1×10¹⁸/cm³ and lower thanor equal to 5×10²¹/cm³.

In the oxide semiconductor, oxygen is one of main component materials.Thus, it is difficult to accurately estimate the oxygen concentration inthe oxide semiconductor layer 102 by a method such as secondary ion massspectrometry (SIMS). In other words, it can be said that it is hard todetermine whether or not oxygen is intentionally added to the oxidesemiconductor layer 102.

It is known that there are isotopes of oxygen, such as ¹⁷O and ¹⁸O, andthe proportions of ¹⁷O and ¹⁸O in all of the oxygen atoms in nature are0.037% and 0.204%, respectively. That is to say, it is possible tomeasure the concentrations of these isotopes in the oxide semiconductorlayer 102 by a method such as SIMS; therefore, the oxygen concentrationin the oxide semiconductor layer 102 may be able to be estimated moreaccurately by measuring the concentration of such an isotope. Thus, theconcentration of the isotope may be measured to determine whether or notoxygen is intentionally added to the oxide semiconductor layer 102.

Heat treatment is preferably performed after oxygen is added to theoxide semiconductor film. As the preferable heating conditions, theheating temperature is higher than or equal to 250° C. and lower than orequal to 700° C., more preferably higher than or equal to 300° C. andlower than or equal to 450° C., and the heating atmosphere is an oxygenatmosphere. Alternatively, the heat treatment may be performed under anitrogen atmosphere, reduced pressure, or the air (ultra-dry air).

In the case where the oxide semiconductor layer is a crystalline oxidesemiconductor layer, part of the crystalline oxide semiconductor layermight become amorphous by the addition of the oxygen 431. In thisinstance, the crystallinity of the oxide semiconductor layer can berecovered by performing heat treatment after the addition of the oxygen431.

As described above, a semiconductor device formed using an oxidesemiconductor layer, which has stable electrical characteristics, can beprovided. Accordingly, a semiconductor device with high reliability canbe provided.

The structures, methods, and the like described in this embodiment canbe combined as appropriate with any of the structures, methods, and thelike described in the other embodiments.

Embodiment 3

In this embodiment, another embodiment of a semiconductor device and amethod of manufacturing the semiconductor device will be described withreference to FIGS. 6A to 6C. In this embodiment, the same portions asthose in the above embodiment and portions having functions similar tothose in the above embodiment and the same steps as those in the aboveembodiment and steps similar to those in the above embodiment may behandled as in the above embodiment, and repeated description is omitted.In addition, detailed description of the same portions is not repeated.

Described in this embodiment is an example in which low-resistanceregions are formed in an oxide semiconductor layer in a method ofmanufacturing a semiconductor device according to one embodiment of thedisclosed invention. The low-resistance regions can be formed by addingan impurity (also called a dopant) for changing the electricalconductivity to the oxide semiconductor layer.

As in the manufacturing process described in Embodiment 1, the firstbuffer layer 101, the oxide semiconductor layer 102, the second bufferlayer 103, the gate insulating film 402, and the gate electrode layer401 are formed over the substrate 400 having an insulating surface onwhich the oxide insulating film 436 is provided.

Next, a dopant 421 is selectively added to the oxide semiconductor layer102 through the gate insulating film 402 and the second buffer layer 103with the use of the gate electrode layer 401 as a mask, so thatlow-resistance regions 122 a and 122 b are formed (see FIG. 6A).

The dopant 421 is an impurity for changing the electrical conductivityof the oxide semiconductor layer 102. As the dopant 421, one or moreselected from a Group 15 element (typically, phosphorus (P), arsenic(As), and antimony (Sb)), boron (B), aluminum (Al), nitrogen (N), argon(Ar), helium (He), neon (Ne), indium (In), fluorine (F), chlorine (CO,titanium (Ti), and zinc (Zn) can be used.

In this embodiment, the dopant 421 is added to the oxide semiconductorlayer 102 through the gate insulating film 402 and the second bufferlayer 103 by an implantation method. The dopant 421 can be added by anion implantation method, an ion doping method, a plasma immersion ionimplantation method, or the like. In that case, it is preferable to usea single ion of the dopant 421 or a fluoride ion or a chloride ionthereof.

The addition of the dopant 421 may be controlled by appropriatelysetting implantation conditions such as acceleration voltage and a dose,the thicknesses of the gate insulating film 402 and the second bufferlayer 103 through which the dopant 421 passes, and the like. In thisembodiment, boron is used as the dopant 421, and boron ions areimplanted by an ion implantation method. Note that the dose of thedopant 421 may be greater than or equal to 1×10¹³ ions/cm² and less thanor equal to 5×10¹⁶ ions/cm².

The concentration of the dopant 421 in the low-resistance region 122 aand that in the low-resistance region 122 b are preferably higher thanor equal to 5×10¹⁸/cm³ and lower than or equal to 1×10²²/cm³.

The addition of the dopant 421 may be performed while the substrate 400is heated.

The addition of the dopant 421 to the oxide semiconductor layer 102 maybe performed plural times, and plural kinds of dopant may be used.

Depending on how deep the dopant 421 is added, the dopant 421 isincluded and a pair of low-resistance regions is formed also in a regionof the first buffer layer 101 or the second buffer layer 103 which doesnot overlap with the gate electrode layer 401.

After the dopant 421 is added, heat treatment may be performed. As thepreferable heating conditions, the heating temperature is higher than orequal to 300° C. and lower than or equal to 700° C., more preferablyhigher than or equal to 300° C. and lower than or equal to 450° C., theheating time is one hour, and the heating atmosphere is an oxygenatmosphere. Alternatively, the heat treatment may be performed under anitrogen atmosphere, reduced pressure, or the air (ultra-dry air).

In the case where the oxide semiconductor layer 102 is a crystallineoxide semiconductor film, part of the crystalline oxide semiconductorfilm might become amorphous by the addition of the dopant 421. In thisinstance, the crystallinity of the oxide semiconductor layer 102 can berecovered by performing heat treatment after the addition of the dopant421.

Next, the insulating film 407 is formed over the gate insulating film402 and the gate electrode layer 401, and the source electrode layer 405a and the drain electrode layer 405 b are formed so as to beelectrically connected to the oxide semiconductor layer 102 throughcontact holes provided in the insulating film 407 (see FIG. 6B).

Through the above steps, a transistor 420 according to this embodimentcan be manufactured. The oxide semiconductor layer 102 in the transistor420 includes the low-resistance regions 122 a and 122 b between which achannel formation region overlapping with the gate electrode layer 401is sandwiched.

FIG. 6C illustrates a transistor 430 having a structure in which adopant is added to the transistor 410 including the oxygen-excess regionof Embodiment 2 and thus low-resistance regions are formed.

After the oxide semiconductor layer 102 including the oxygen-excessregion 112 is formed through the steps illustrated in FIGS. 5A and 5B, adopant is added with the use of the gate electrode layer 401 as a mask;thus, the transistor 430 includes low-resistance regions 124 a and 124 bincluding the dopant and excess oxygen, between which a channelformation region 124 c including excess oxygen is sandwiched.

With an oxide semiconductor layer including low-resistance regionsbetween which a channel formation region is sandwiched in the channellength direction, the transistors 420 and 430 described in thisembodiment have excellent on characteristics (e.g., on-state current andfield-effect mobility) and enable high-speed operation and high-speedresponse. Further, the low-resistance regions are formed in aself-aligned manner and do not overlap with the gate electrode layer;thus, parasitic capacitance can be reduced. A reduction in parasiticcapacitance leads to lowering of power consumption of the wholesemiconductor device.

The structures, methods, and the like described in this embodiment canbe combined as appropriate with any of the structures, methods, and thelike described in the other embodiments.

Embodiment 4

A semiconductor device with a display function (also referred to asdisplay device) can be manufactured using any of the transistorsdescribed in Embodiments 1 to 3. Moreover, some or all of the drivercircuits which include the transistors can be formed over a substratewhere the pixel portion is formed, whereby a system-on-panel can beobtained.

In FIG. 7A, a sealant 4005 is provided so as to surround a pixel portion4002 provided over a first substrate 4001, and the pixel portion 4002 issealed between the first substrate 4001 and a second substrate 4006. InFIG. 7A, a signal line driver circuit 4003 and a scan line drivercircuit 4004 which are formed using a single crystal semiconductor filmor a polycrystalline semiconductor film over a substrate separatelyprepared are mounted over the first substrate 4001, in a region that isdifferent from the region surrounded by the sealant 4005. Varioussignals and potentials which are provided to the pixel portion 4002through the signal line driver circuit 4003 and the scan line drivercircuit 4004 are supplied from flexible printed circuits (FPCs) 4018 aand 4018 b.

In FIGS. 7B and 7C, the sealant 4005 is provided so as to surround thepixel portion 4002 and the scan line driver circuit 4004 which areprovided over the first substrate 4001. The second substrate 4006 isprovided over the pixel portion 4002 and the scan line driver circuit4004. Consequently, the pixel portion 4002 and the scan line drivercircuit 4004 are sealed together with a display element, by the firstsubstrate 4001, the sealant 4005, and the second substrate 4006. InFIGS. 7B and 7C, the signal line driver circuit 4003 which is formedusing a single crystal semiconductor film or a polycrystallinesemiconductor film over a substrate separately prepared is mounted overthe first substrate 4001, in a region that is different from the regionsurrounded by the sealant 4005. In FIGS. 7B and 7C, various signals andpotentials which are provided to the pixel portion 4002 through thesignal line driver circuit 4003 and the scan line driver circuit 4004are supplied from an FPC 4018.

Although FIGS. 7B and 7C each illustrate an example in which the signalline driver circuit 4003 is formed separately and mounted on the firstsubstrate 4001, the display device according to the present invention isnot limited to this structure. The scan line driver circuit may beseparately formed and then mounted, or only part of the signal linedriver circuit or only part of the scan line driver circuit may beseparately formed and then mounted.

Note that there is no particular limitation on a connection method of aseparately formed driver circuit, and a chip on glass (COG) method, awire bonding method, a tape automated bonding (TAB) method or the likecan be used. FIG. 7A illustrates an example in which the signal linedriver circuit 4003 and the scan line driver circuit 4004 are mounted bya COG method. FIG. 7B illustrates an example in which the signal linedriver circuit 4003 is mounted by a COG method. FIG. 7C illustrates anexample in which the signal line driver circuit 4003 is mounted by a TABmethod.

Note that the display device includes a panel in which the displayelement is sealed, and a module in which an IC and the like including acontroller are mounted on the panel.

Specifically, a display device in this specification means an imagedisplay device, a display device, or a light source (including alighting device). Furthermore, the display device also includes not onlya panel in which the display element is sealed but also the followingmodules in its category: a module to which a connector such as an FPC, aTAB tape, or a TCP is attached; a module having a TAB tape or a TCP atthe tip of which a printed wiring board is provided; and a module inwhich an integrated circuit (IC) is directly mounted on a displayelement by a COG method.

The pixel portion and the scan line driver circuit provided over thefirst substrate include a plurality of transistors, and any of thetransistors described in Embodiments 1 to 3 can be applied thereto.

As the display element provided in the display device, a liquid crystalelement (also referred to as liquid crystal display element) or alight-emitting element (also referred to as light-emitting displayelement) can be used. The light-emitting element includes, in itscategory, an element whose luminance is controlled by a current or avoltage, and specifically includes, in its category, an inorganicelectroluminescent (EL) element, an organic EL element, and the like.Furthermore, a display medium whose contrast is changed by an electriceffect, such as an electronic ink display device (electronic paper), canbe used.

Embodiments of the semiconductor device will be described with referenceto FIGS. 7A to 7C and FIGS. 8A and 8B. FIGS. 8A and 8B correspond tocross-sectional views taken along line M-N in FIG. 7B.

As illustrated in FIGS. 7A to 7C and FIGS. 8A and 8B, the semiconductordevice includes a connection terminal electrode 4015 and a terminalelectrode 4016. The connection terminal electrode 4015 and the terminalelectrode 4016 are electrically connected to a terminal included in theFPC 4018 through an anisotropic conductive film 4019.

The connection terminal electrode 4015 is formed using the sameconductive film as a first electrode layer 4030, and the terminalelectrode 4016 is formed using the same conductive film as sourceelectrode layers and drain electrode layers of transistors 4010 and4011.

Each of the pixel portion 4002 and the scan line driver circuit 4004which are provided over the first substrate 4001 includes a plurality oftransistors. In FIG. 8A, the transistor 4010 included in the pixelportion 4002 and the transistor 4011 included in the scan line drivercircuit 4004 are illustrated as an example. Further, in FIG. 8B, thetransistor 4010 included in the pixel portion 4002 and the transistor4011 included in the scan line driver circuit 4004 are illustrated as anexample. In FIG. 8A, an insulating film 4020 is provided over thetransistors 4010 and 4011, and in FIG. 8B, insulating films 4020 and4021 are provided over the transistors 4010 and 4011. Note that aninsulating film 4023 is an insulating film serving as a base film.

Any of the transistors described in Embodiments 1 to 3 can be applied tothe transistor 4010 and the transistor 4011. Described in thisembodiment is an example in which a transistor having a structuresimilar to that of the transistor 510 described in Embodiment 1 is used.Variation in the electrical characteristics of the transistors 4010 and4011 is suppressed and the transistors 4010 and 4011 are electricallystable. As described above, a semiconductor device with high reliabilitycan be provided as the semiconductor device in this embodiment. Thetransistors 4010 and 4011 include a first buffer film 4040.

The transistor 4010 included in the pixel portion 4002 is electricallyconnected to a display element to form a display panel. There is noparticular limitation on the kind of display element as long as displaycan be performed, and a variety of kinds of display elements can beemployed.

An example of a liquid crystal display device using a liquid crystalelement as a display element is shown in FIG. 8A. In FIG. 8A, a liquidcrystal element 4013 includes the first electrode layer 4030, a secondelectrode layer 4031, and a liquid crystal layer 4008. Insulating films4032 and 4033 serving as alignment films are provided so that the liquidcrystal layer 4008 is interposed therebetween. The second electrodelayer 4031 is provided on the second substrate 4006 side, and the firstelectrode layer 4030 and the second electrode layer 4031 are stacked,with the liquid crystal layer 4008 interposed therebetween.

A columnar spacer denoted by reference numeral 4035 is obtained byselective etching of an insulating film and is provided in order tocontrol the thickness of the liquid crystal layer 4008 (a cell gap).Alternatively, a spherical spacer may also be used.

In the case where a liquid crystal element is used as the displayelement, a thermotropic liquid crystal, a ferroelectric liquid crystal,an anti-ferroelectric liquid crystal, or the like can be used. Theseliquid crystals may be a low molecular compound or a high molecularcompound. Such a liquid crystal material (liquid crystal composition)exhibits a cholesteric phase, a smectic phase, a cubic phase, a chiralnematic phase, an isotropic phase, or the like depending on conditions.

Alternatively, a liquid crystal composition exhibiting a blue phase forwhich an alignment film is unnecessary may be used for the liquidcrystal layer 4008. A blue phase is one of liquid crystal phases, whichis generated just before a cholesteric phase changes into an isotropicphase while the temperature of a cholesteric liquid crystal isincreased. The blue phase can be exhibited using a liquid crystalcomposition which is a mixture of a liquid crystal and a chiral agent.In order to increase the temperature range where the blue phase isexhibited, a liquid crystal layer may be formed by adding apolymerizable monomer, a polymerization initiator, and the like to aliquid crystal composition exhibiting a blue phase and by performingpolymer stabilization treatment. The liquid crystal compositionexhibiting a blue phase has a short response time, and has opticalisotropy, which contributes to the exclusion of the alignment processand reduction of viewing angle dependence. In addition, since analignment film does not need to be provided and rubbing treatment isunnecessary, electrostatic discharge damage caused by the rubbingtreatment can be prevented and defects and damage of the liquid crystaldisplay device in the manufacturing process can be reduced. Thus,productivity of the liquid crystal display device can be improved.

The specific resistivity of the liquid crystal material is higher thanor equal to 1×10⁹ Ω·cm, preferably higher than or equal to 1×10¹¹ Ω·cm,further preferably higher than or equal to 1×10¹² Ω·cm. Note that thespecific resistivity in this specification is measured at 20° C.

The size of a storage capacitor formed in the liquid crystal displaydevice is set considering the leakage current of the transistor providedin the pixel portion or the like so that charge can be held for apredetermined period. The size of the storage capacitor may be setconsidering the off-state current of the transistor or the like. Byusing a transistor including an oxide semiconductor layer, which isdisclosed in this specification, it is enough to provide a storagecapacitor having a capacitance that is ⅓ or less, preferably ⅕ or lessof liquid crystal capacitance of each pixel.

In the transistor including an oxide semiconductor layer, which isdisclosed in this specification, the current in an off state (off-statecurrent) can be made small. Accordingly, an electric signal such as animage signal can be held for a longer period, and a writing interval canbe set longer. Accordingly, the frequency of refresh operation can bereduced, which leads to an effect of suppressing power consumption.

The transistor including an oxide semiconductor layer, which isdisclosed in this specification, can have relatively high field-effectmobility; thus, the scan line driver circuit 4004 can operate at highspeed. According to this embodiment, a switching transistor in a pixelportion and a driver transistor in a driver circuit portion can beformed over one substrate. That is, since a semiconductor device formedof a silicon wafer or the like is not additionally needed as a drivercircuit, the number of components of the semiconductor device can bereduced.

For the liquid crystal display device, a twisted nematic (TN) mode, anin-plane-switching (IPS) mode, a fringe field switching (FFS) mode, anaxially symmetric aligned micro-cell (ASM) mode, an optical compensatedbirefringence (OCB) mode, a ferroelectric liquid crystal (FLC) mode, ananti-ferroelectric liquid crystal (AFLC) mode, or the like can be used.

A normally black liquid crystal display device such as a transmissiveliquid crystal display device utilizing a vertical alignment (VA) modemay be used. Some examples are given as the vertical alignment mode. Forexample, a multi-domain vertical alignment (MVA) mode, a patternedvertical alignment (PVA) mode, or an advanced super view (ASV) mode canbe used. Furthermore, this embodiment can be applied to a VA liquidcrystal display device. The VA liquid crystal display device has a kindof form in which alignment of liquid crystal molecules of a liquidcrystal display panel is controlled. In the VA liquid crystal displaydevice, liquid crystal molecules are aligned in a vertical directionwith respect to a panel surface when no voltage is applied. Moreover, itis possible to use a method called domain multiplication or multi-domaindesign, in which a pixel is divided into some regions (subpixels) andmolecules are aligned in different directions in their respectiveregions.

In the display device, a black matrix (light-blocking layer), an opticalmember (optical substrate) such as a polarizing member, a retardationmember, or an anti-reflection member, and the like are provided asappropriate. For example, circular polarization may be obtained by usinga polarizing substrate and a retardation substrate. In addition, abacklight, a side light, or the like may be used as a light source.

As a display method in the pixel portion, a progressive method, aninterlace method, or the like can be employed. Further, color elementscontrolled in a pixel at the time of color display are not limited tothree colors: R, G, and B (R, G, and B correspond to red, green, andblue, respectively). For example, R, G, B, and W (W corresponds towhite); R, G, B, and one or more of yellow, cyan, magenta, and the like;or the like can be used. Further, the sizes of display regions may bedifferent between respective dots of color elements. Note that oneembodiment of the invention disclosed herein is not limited to theapplication to a display device for color display; one embodiment of theinvention disclosed herein can also be applied to a display device formonochrome display.

Alternatively, as the display element included in the display device, alight-emitting element utilizing electroluminescence can be used.Light-emitting elements utilizing electroluminescence are classifiedaccording to whether a light-emitting material is an organic compound oran inorganic compound. In general, the former is referred to as organicEL element, and the latter is referred to as inorganic EL element.

In an organic EL element, by application of voltage to a light-emittingelement, electrons and holes are separately injected from a pair ofelectrodes into a layer containing a light-emitting organic compound,and current flows. The carriers (electrons and holes) are recombined,and thus the light-emitting organic compound is excited. Thelight-emitting organic compound returns to a ground state from theexcited state, thereby emitting light. Owing to such a mechanism, thislight-emitting element is referred to as current-excitationlight-emitting element. Note that an example of an organic EL element isdescribed here as a light-emitting element.

In order to extract light emitted from the light-emitting element, atleast one of the pair of electrodes has a light-transmitting property. Atransistor and a light-emitting element are formed over a substrate. Thelight-emitting element can have a top emission structure in which lightemission is extracted through a surface opposite to the substrate; abottom emission structure in which light emission is extracted through asurface on the substrate side; or a dual emission structure in whichlight emission is extracted through the surface opposite to thesubstrate and the surface on the substrate side, and a light-emittingelement having any of these emission structures can be used.

An example of a light-emitting device including a light-emitting elementas a display element is illustrated in FIG. 8B. A light-emitting element4513 is electrically connected to the transistor 4010 provided in thepixel portion 4002. A structure of the light-emitting element 4513illustrated in FIG. 8B is not limited to the illustrated layeredstructure including the first electrode layer 4030, anelectroluminescent layer 4511, and the second electrode layer 4031. Thestructure of the light-emitting element 4513 can be changed asappropriate depending on the direction in which light is extracted fromthe light-emitting element 4513, or the like.

A partition wall 4510 can be formed using an organic insulating materialor an inorganic insulating material. It is particularly preferable thatthe partition wall 4510 be formed using a photosensitive resin materialto have an opening over the first electrode layer 4030 so that asidewall of the opening is formed as a tilted surface with continuouscurvature.

The electroluminescent layer 4511 may be formed using either a singlelayer or a plurality of layers stacked.

A protective film may be formed over the second electrode layer 4031 andthe partition wall 4510 in order to prevent entry of oxygen, hydrogen,moisture, carbon dioxide, or the like into the light-emitting element4513. As the protective film, a silicon nitride film, a silicon nitrideoxide film, a DLC film, or the like can be formed.

Further, a layer containing an organic compound may be deposited by anevaporation method to cover the light-emitting element 4513 so thatoxygen, hydrogen, moisture, carbon dioxide, and the like do not enterthe light-emitting element 4513.

In addition, in a space which is formed with the first substrate 4001,the second substrate 4006, and the sealant 4005, a filler 4514 isprovided for sealing. In this manner, the light-emitting element 4513and the like are preferably packaged (sealed) with a protective film(such as a laminate film or an ultraviolet curable resin film) or acover material with high air-tightness and little degasification so thatthe light-emitting element 4513 and the like are not exposed to theoutside air.

As the filler 4514, an ultraviolet curable resin or a thermosettingresin can be used as well as an inert gas such as nitrogen or argon. Forexample, polyvinyl chloride (PVC), an acrylic resin, polyimide, an epoxyresin, a silicone resin, polyvinyl butyral (PVB), or ethylene vinylacetate copolymer (EVA) can be used.

In addition, as needed, an optical film such as a polarizing plate, acircularly polarizing plate (including an elliptically polarizingplate), a retardation plate (a quarter-wave plate or a half-wave plate),or a color filter may be provided as appropriate on a light-emittingsurface of the light-emitting element. Further, the polarizing plate orthe circularly polarizing plate may be provided with an anti-reflectionfilm. For example, anti-glare treatment by which reflected light can bediffused by projections and depressions on the surface so as to reducethe glare can be performed.

Further, electronic paper in which electronic ink is driven can beprovided as the display device. The electronic paper is also referred toas electrophoretic display device (electrophoretic display) and isadvantageous in that it has the same level of readability as plainpaper, it has lower power consumption than other display devices, and itcan be made thin and lightweight.

Although the electrophoretic display device can have various modes, theelectrophoretic display device contains a plurality of microcapsulesdispersed in a solvent or a solute, each microcapsule containing firstparticles which are positively charged and second particles which arenegatively charged. By applying an electric field to the microcapsules,the particles in the microcapsules move in opposite directions to eachother and only the color of the particles gathering on one side isdisplayed. Note that the first particles and the second particles eachcontain a pigment and do not move without an electric field. Moreover,the first particles and the second particles have different colors(which may be colorless).

A solution in which the above microcapsules are dispersed in a solventis referred to as electronic ink. Furthermore, by using a color filteror particles that have a pigment, color display can also be achieved.

As the electronic paper, a display device using a twisting ball displaysystem can be used. The twisting ball display system refers to a methodin which spherical particles each colored in black and white arearranged between a first electrode layer and a second electrode layerwhich are electrode layers used for a display element, and a potentialdifference is generated between the first electrode layer and the secondelectrode layer to control the orientation of the spherical particles,so that display is performed.

Note that in FIGS. 7A to 7C and FIGS. 8A and 8B, a flexible substrate aswell as a glass substrate can be used as the first substrate 4001 andthe second substrate 4006. For example, a plastic substrate having alight-transmitting property or the like can be used. As plastic, afiberglass-reinforced plastics (FRP) plate, a polyvinyl fluoride (PVF)film, a polyester film, or an acrylic resin film can be used. In thecase where a light-transmitting property is not needed, a metalsubstrate (metal film) of aluminum, stainless steel, or the like may beused. For example, a sheet with a structure in which an aluminum foil isinterposed between PVF films or polyester films can be used.

In this embodiment, an aluminum oxide film is used as the insulatingfilm 4020. In this embodiment, the aluminum oxide film provided as theinsulating film 4020 over the oxide semiconductor layer has a highshielding effect (blocking effect) of preventing penetration of bothoxygen and impurities such as hydrogen and moisture. Therefore, in andafter the manufacturing process, the aluminum oxide film functions as aprotective film for preventing entry of an impurity such as hydrogen ormoisture, which causes a change in characteristics, into the oxidesemiconductor layer and release of oxygen, which is a main componentmaterial of the oxide semiconductor, from the oxide semiconductor layer.

Further, the insulating film 4021 functioning as a planarizationinsulating film can be formed using an organic material having heatresistance, such as an acrylic-, polyimide-, or benzocyclobutene-basedresin, polyamide, or epoxy. Other than such organic materials, it isalso possible to use a low-dielectric constant material (low-kmaterial), a siloxane-based resin, phosphosilicate glass (PSG),borophosphosilicate glass (BPSG), or the like. Note that the insulatingfilm may be formed by stacking a plurality of insulating films formedusing any of these materials.

The first electrode layer and the second electrode layer (which may becalled pixel electrode layer, common electrode layer, counter electrodelayer, or the like) for applying voltage to the display element may havelight-transmitting properties or light-reflecting properties, whichdepends on the direction in which light is extracted, the position wherethe electrode layer is provided, the pattern structure of the electrodelayer, and the like.

The first electrode layer 4030 and the second electrode layer 4031 canbe formed using a light-transmitting conductive material such as indiumoxide containing tungsten oxide, indium zinc oxide containing tungstenoxide, indium oxide containing titanium oxide, indium tin oxidecontaining titanium oxide, indium tin oxide (ITO), indium zinc oxide,indium tin oxide to which silicon oxide is added, or graphene.

The first electrode layer 4030 and the second electrode layer 4031 canbe formed using one or plural kinds selected from a metal such astungsten (W), molybdenum (Mo), zirconium (Zr), hafnium (Hf), vanadium(V), niobium (Nb), tantalum (Ta), chromium (Cr), cobalt (Co), nickel(Ni), titanium (Ti), platinum (Pt), aluminum (Al), copper (Cu), orsilver (Ag); an alloy thereof and a nitride thereof.

A protection circuit for protecting the driver circuit may be provided.The protection circuit is preferably formed using a nonlinear element.

As described above, by using any of the transistors described inEmbodiments 1 to 3, a semiconductor device with high reliability can beprovided. Note that the transistor described in Embodiment 1 can beapplied to semiconductor devices having a variety of functions, such asa power device which is mounted on a power supply circuit and asemiconductor integrated circuit like LSI.

This embodiment can be implemented in appropriate combination with anyof the structures described in the other embodiments.

Embodiment 5

A semiconductor device having an image sensor function of reading dataon an object can be manufactured using any of the transistors describedin Embodiments 1 to 3.

FIG. 9A illustrates an example of a semiconductor device having an imagesensor function. FIG. 9A is an equivalent circuit diagram of aphotosensor, and FIG. 9B is a cross-sectional view illustrating part ofthe photosensor.

One electrode of a photodiode 602 is electrically connected to aphotodiode reset signal line 658, and the other electrode of thephotodiode 602 is electrically connected to a gate of a transistor 640.One of a source and a drain of the transistor 640 is electricallyconnected to a photosensor reference signal line 672, and the other ofthe source and the drain of the transistor 640 is electrically connectedto one of a source and a drain of a transistor 656. A gate of thetransistor 656 is electrically connected to a gate signal line 659, andthe other of the source and the drain thereof is electrically connectedto a photosensor output signal line 671.

Note that in circuit diagrams in this specification, a transistorincluding an oxide semiconductor film is denoted by a symbol “OS” sothat it can be identified as a transistor including an oxidesemiconductor film. In FIG. 9A, the transistor 640 and the transistor656 are each a transistor including an oxide semiconductor stack, towhich any of the transistors described in Embodiments 1 to 3 can beapplied. Described in this embodiment is an example in which atransistor having a structure similar to that of the transistor 540described in Embodiment 2 is used.

FIG. 9B is a cross-sectional view of the photodiode 602 and thetransistor 640 in the photosensor. The photodiode 602 functioning as asensor and the transistor 640 are provided over a substrate 601 (TFTsubstrate) having an insulating surface. A substrate 613 is providedover the photodiode 602 and the transistor 640 with the use of anadhesive layer 608.

An insulating film 631, an insulating film 632, an interlayer insulatingfilm 633, and an interlayer insulating film 634 are provided over thetransistor 640. The photodiode 602 is provided over the interlayerinsulating film 633. In the photodiode 602, a first semiconductor film606 a, a second semiconductor film 606 b, and a third semiconductor film606 c are sequentially stacked from the interlayer insulating film 633side, between electrode layers 641 a and 641 b formed over theinterlayer insulating film 633 and an electrode layer 642 formed overthe interlayer insulating film 634.

The electrode layer 641 b is electrically connected to a conductivelayer 643 formed over the interlayer insulating film 634, and theelectrode layer 642 is electrically connected to an electrode layer 645through the electrode layer 641 a. The electrode layer 645 iselectrically connected to a gate electrode layer of the transistor 640,and the photodiode 602 is electrically connected to the transistor 640.

Here, a pin photodiode in which a semiconductor film having p-typeconductivity as the first semiconductor film 606 a, a high-resistancesemiconductor film (i-type semiconductor film) as the secondsemiconductor film 606 b, and a semiconductor film having n-typeconductivity as the third semiconductor film 606 c are stacked isillustrated as an example.

The first semiconductor film 606 a is a p-type semiconductor film andcan be formed using an amorphous silicon film containing an impurityelement imparting p-type conductivity. The first semiconductor film 606a is formed by a plasma CVD method with the use of a semiconductorsource gas containing an impurity element belonging to Group 13 (e.g.,boron (B)). As the semiconductor source gas, silane (SiH₄) may be used.Alternatively, Si₂H₆, SiH₂Cl₂, SiHCl₃, SiCl₄, SiF₄, or the like may beused. Further alternatively, an amorphous silicon film which does notcontain an impurity element may be formed, and then an impurity elementmay be introduced into the amorphous silicon film by a diffusion methodor an ion implantation method. Heating or the like may be conductedafter introducing the impurity element by an ion implantation method orthe like in order to diffuse the impurity element. In this case, as amethod of forming the amorphous silicon film, an LPCVD method, a vapordeposition method, a sputtering method, or the like may be used. Thefirst semiconductor film 606 a is preferably formed to have a thicknessgreater than or equal to 10 nm and less than or equal to 50 nm.

The second semiconductor film 606 b is an i-type semiconductor film(intrinsic semiconductor film) and is formed using an amorphous siliconfilm. As for formation of the second semiconductor film 606 b, anamorphous silicon film is formed by a plasma CVD method with the use ofa semiconductor source gas. As the semiconductor source gas, silane(SiH₄) may be used. Alternatively, Si₂H₆, SiH₂Cl₂, SiHCl₃, SiCl₄, SiF₄,or the like may be used. The second semiconductor film 606 b may beformed by an LPCVD method, a vapor deposition method, a sputteringmethod, or the like. The second semiconductor film 606 b is preferablyformed to have a thickness greater than or equal to 200 nm and less thanor equal to 1000 nm.

The third semiconductor film 606 c is an n-type semiconductor film andis formed using an amorphous silicon film containing an impurity elementimparting n-type conductivity. The third semiconductor film 606 c isformed by a plasma CVD method with the use of a semiconductor source gascontaining an impurity element belonging to Group 15 (e.g., phosphorus(P)). As the semiconductor source gas, silane (SiH₄) may be used.Alternatively, Si₂H₆, SiH₂Cl₂, SiHCl₃, SiCl₄, SiF₄, or the like may beused. Further alternatively, an amorphous silicon film which does notcontain an impurity element may be formed, and then an impurity elementmay be introduced into the amorphous silicon film by a diffusion methodor an ion implantation method. Heating or the like may be conductedafter introducing the impurity element by an ion implantation method orthe like in order to diffuse the impurity element. In this case, as amethod of forming the amorphous silicon film, an LPCVD method, a vapordeposition method, a sputtering method, or the like may be used. Thethird semiconductor film 606 c is preferably formed to have a thicknessgreater than or equal to 20 nm and less than or equal to 200 nm.

The first semiconductor film 606 a, the second semiconductor film 606 b,and the third semiconductor film 606 c are not necessarily formed usingan amorphous semiconductor, and may be formed using a polycrystallinesemiconductor or a microcrystalline semiconductor (semi-amorphoussemiconductor: SAS).

The mobility of holes generated by the photoelectric effect is lowerthan the mobility of electrons. Therefore, a pin photodiode has bettercharacteristics when a surface on the p-type semiconductor film side isused as a light-receiving plane. Here, an example in which lightreceived by the photodiode 602 from a surface of the substrate 601, overwhich the pin photodiode is formed, is converted into electric signalsis described. Further, light from the semiconductor film having aconductivity type opposite to that of the semiconductor film on thelight-receiving plane is disturbance light; therefore, the electrodelayer is preferably formed using a light-blocking conductive film. Notethat a surface on the n-type semiconductor film side can alternativelybe used as the light-receiving plane.

With the use of an insulating material, the insulating film 632, theinterlayer insulating film 633, and the interlayer insulating film 634can be formed, depending on the material, using a method such as asputtering method, a plasma CVD method, an SOG method, spin coating,dipping, spray coating, a droplet discharge method (such as an inkjetmethod), screen printing, or offset printing.

In this embodiment, an aluminum oxide film is used as the insulatingfilm 631. The insulating film 631 can be formed by a sputtering methodor a plasma CVD method.

The aluminum oxide film provided as the insulating film 631 over theoxide semiconductor film has a high shielding effect (blocking effect)of preventing penetration of both oxygen and impurities such as hydrogenand moisture.

Therefore, in and after the manufacturing process, the aluminum oxidefilm functions as a protective film for preventing entry of an impuritysuch as hydrogen or moisture, which causes a change in characteristics,into the oxide semiconductor film and release of oxygen, which is a maincomponent material of the oxide semiconductor, from the oxidesemiconductor film.

The insulating film 632 can be formed using an inorganic insulatingmaterial and can have a single-layer structure or a layered structureincluding any of oxide insulating films such as a silicon oxide layer, asilicon oxynitride layer, an aluminum oxide layer, and an aluminumoxynitride layer; and nitride insulating films such as a silicon nitridelayer, a silicon nitride oxide layer, an aluminum nitride layer, and analuminum nitride oxide layer.

For a reduction in surface roughness, an insulating film functioning asa planarization insulating film is preferably used as each of theinterlayer insulating films 633 and 634. For the interlayer insulatingfilms 633 and 634, for example, an organic insulating material havingheat resistance, such as polyimide, an acrylic resin, a benzocyclobuteneresin, polyamide, or an epoxy resin, can be used. Other than suchorganic insulating materials, it is possible to use a single layer orstacked layers of any of low-dielectric constant materials (low-kmaterial) such as a siloxane-based resin, phosphosilicate glass (PSG),and borophosphosilicate glass (BPSG).

With detection of light that enters the photodiode 602, data on anobject to be detected can be read. Note that a light source such as abacklight can be used at the time of reading data on an object to bedetected.

As described above, by using any of the transistors described inEmbodiments 1 to 3, a semiconductor device with high reliability can beprovided.

This embodiment can be implemented in appropriate combination with anyof the structures described in the other embodiments.

Embodiment 6

A semiconductor device disclosed in this specification can be applied toa variety of electronic devices (including a game machine). Examples ofelectronic devices include a television set (also referred to as atelevision or a television receiver), a monitor of a computer, camerassuch as a digital camera and a digital video camera, a digital photoframe, a mobile phone, a portable game machine, a portable informationterminal, an audio reproducing device, a game console (e.g., a pachinkomachine or a slot machine), a housing of a game machine, and the like.Specific examples of such electronic devices are illustrated in FIGS.10A to 10D.

FIG. 10A illustrates a table 9000 having a display portion. In the table9000, a display portion 9003 is incorporated into a housing 9001. Asemiconductor device manufactured according to one embodiment of thepresent invention can be used for the display portion 9003, and an imagecan be displayed on the display portion 9003. Note that the housing 9001is supported by four leg portions 9002. Further, a power cord 9005 forsupplying power is provided for the housing 9001.

The display portion 9003 has a touch-input function. When a user touchesdisplayed buttons 9004 which are displayed on the display portion 9003of the table 9000 with his/her fingers or the like, the user can carryout operation of the screen and input of information. Further, when thetable may be made to communicate with home appliances or control thehome appliances, the display portion 9003 may function as a controldevice which controls the home appliances by operation on the screen.For example, with the use of the semiconductor device having an imagesensor function described in Embodiment 3, the display portion 9003 canfunction as a touch panel.

Further, the screen of the display portion 9003 can be placedperpendicular to a floor with a hinge provided for the housing 9001;thus, the table 9000 can also be used as a television set. A televisionset with a large screen takes up too much space that is available in asmall room. However, with a table including a display portion therein,it is possible to make the use of the space in the room.

FIG. 10B illustrates a television set 9100. In the television set 9100,a display portion 9103 is incorporated in a housing 9101. Asemiconductor device manufactured using one embodiment of the presentinvention can be used in the display portion 9103, so that an image canbe displayed on the display portion 9103. Note that the housing 9101 issupported by a stand 9105 here.

The television set 9100 can be operated with an operation switch of thehousing 9101 or a separate remote controller 9110. Channels and volumecan be controlled with an operation key 9109 of the remote controller9110 so that an image displayed on the display portion 9103 can becontrolled. Furthermore, the remote controller 9110 may be provided witha display portion 9107 for displaying data output from the remotecontroller 9110.

The television set 9100 illustrated in FIG. 10B is provided with areceiver, a modem, and the like. With the receiver, the television set9100 can receive a general television broadcast. Further, when thetelevision set 9100 is connected to a communication network with orwithout wires connection via the modem, one-way (from a transmitter to areceiver) or two-way (between a transmitter and a receiver or betweenreceivers) data communication can be performed.

By using the semiconductor device described in the above embodiment, atelevision set with high reliability can be provided.

FIG. 10C illustrates a computer which includes a main body 9201, ahousing 9202, a display portion 9203, a keyboard 9204, an externalconnection port 9205, a pointing device 9206, and the like. The computerincludes a semiconductor device manufactured according to one embodimentof the present invention for the display portion 9203.

By using the semiconductor device described in the above embodiment, acomputer with high reliability can be provided.

FIG. 10D illustrates an example of a mobile phone. A mobile phone 9500is provided with a display portion 9502 incorporated in a housing 9501,operation buttons 9503 and 9507, an external connection port 9504, aspeaker 9505, a microphone 9506, and the like. Note that the mobilephone 9500 is manufactured using a semiconductor device manufacturedusing one embodiment of the present invention for the display portion9502.

Users can input data, make a call, or text a message by touching thedisplay portion 9502 of the mobile phone 9500 illustrated in FIG. 10Dwith their fingers or the like.

There are mainly three screen modes for the display portion 9502. Thefirst mode is a display mode mainly for displaying images. The secondmode is an input mode mainly for inputting data such as text. The thirdmode is a display-and-input mode in which two modes of the display modeand the input mode are combined.

For example, in the case of making a call or text messaging, a textinput mode mainly for inputting text is selected for the display portion9502 so that characters displayed on a screen can be input. In thiscase, it is preferable to display a keyboard or number buttons on almostthe entire screen of the display portion 9502.

By providing a detection device which includes a sensor for detectinginclination, such as a gyroscope or an acceleration sensor, inside themobile phone 9500, the direction of the mobile phone 9500 (whether themobile phone 9500 is placed horizontally or vertically for a landscapemode or a portrait mode) is determined so that display on the screen ofthe display portion 9502 can be automatically switched.

In addition, the screen mode is switched by touching the display portion9502 or operating the operation button 9503 of the housing 9501.Alternatively, the screen modes can be switched depending on kinds ofimages displayed on the display portion 9502. For example, when a signalof an image displayed on the display portion is a signal of moving imagedata, the screen mode is switched to the display mode. When the signalis a signal of text data, the screen mode is switched to the input mode.

Moreover, in the input mode, when input by touching the display portion9502 is not performed within a specified period of time while a signaldetected by an optical sensor in the display portion 9502 is detected,the screen mode may be controlled so as to be switched from the inputmode to the display mode.

The display portion 9502 can also function as an image sensor. Forexample, an image of a palm print, a fingerprint, or the like is takenby touching the display portion 9502 with the palm or the finger,whereby personal authentication can be performed. Further, by providinga backlight or a sensing light source which emits a near-infrared lightin the display portion, an image of a finger vein, a palm vein, or thelike can be taken.

The structures, methods, and the like described in this embodiment canbe combined as appropriate with any of the structures, methods, and thelike described in the other embodiments.

EXPLANATION OF REFERENCE

101: first buffer layer, 101 a: first buffer film, 102: oxidesemiconductor layer, 102 a: oxide semiconductor film, 103: second bufferlayer, 103 a: second buffer film, 112: oxygen-excess region, 122 a:low-resistance region, 122 b: low-resistance region, 124 a:low-resistance region, 124 b: low-resistance region, 124 c: channelformation region, 400: substrate, 401: gate electrode layer, 402: gateinsulating film, 405 a: source electrode layer, 405 b: drain electrodelayer, 407: insulating film, 410: transistor, 420: transistor, 421:dopant, 430: transistor, 431: oxygen, 436: oxide insulating film, 510:transistor, 520: transistor, 530: transistor, 540: transistor, 601:substrate, 602: photodiode, 606 a: semiconductor film, 606 b:semiconductor film, 606 c: semiconductor film, 608: adhesive layer, 613:substrate, 631: insulating film, 632: insulating film, 633: interlayerinsulating film, 634: interlayer insulating film, 640: transistor, 641a: electrode layer, 641 b: electrode layer, 642: electrode layer, 643:conductive layer, 645: electrode layer, 656: transistor, 658: photodiodereset signal line, 659: gate signal line, 671: photosensor output signalline, 672: photosensor reference signal line, 4001: substrate, 4002:pixel portion, 4003: signal line driver circuit, 4004: scan line drivercircuit, 4005: sealant, 4006: substrate, 4008: liquid crystal layer,4010: transistor, 4011: transistor, 4013: liquid crystal element, 4015:connection terminal electrode, 4016: terminal electrode, 4019:anisotropic conductive film, 4020: insulating film, 4021: insulatingfilm, 4023: insulating film, 4030: electrode layer, 4031: electrodelayer, 4032: insulating film, 4033: insulating film, 4040: first bufferfilm, 4510: partition wall, 4511: electroluminescent layer, 4513:light-emitting element, 4514: filler, 9000: table, 9001: housing, 9002:leg portion, 9003: display portion, 9004: displayed button, 9005: powercord, 9100: television set, 9101: housing, 9103: display portion, 9105:stand, 9107: display portion, 9109: operation key, 9110: remotecontroller, 9201: main body, 9202: housing, 9203: display portion, 9204:keyboard, 9205: external connection port, 9206: pointing device, 9500:mobile phone, 9501: housing, 9502: display portion, 9503: operationbutton, 9504: external connection port, 9505: speaker, 9506: microphone,and 9507: operation button

This application is based on Japanese Patent Application serial no.2011-152164 filed with Japan Patent Office on Jul. 8, 2011, the entirecontents of which are hereby incorporated by reference.

1. A transistor comprising: a first buffer layer; an oxide semiconductorlayer on and in contact with the first buffer layer, the oxidesemiconductor layer including a channel region; and a second bufferlayer on and in contact with the oxide semiconductor layer; wherein eachof the first buffer layer and the second buffer layer comprises an oxideof one or more elements selected from aluminum, gallium, zirconium,hafnium, and a rare earth element.